Material Science
Density
100%
Silicon
90%
Electronic Circuit
90%
Intermetallics
84%
Shape Memory
79%
Nanowire
79%
Nanoparticle
79%
Thin Films
79%
Aluminum Oxide
71%
Shear Strength
62%
Transistor
49%
Zirconia
49%
Oxide Compound
46%
Aluminum
44%
Dielectric Material
43%
Nanostructure
42%
Electron Mobility
42%
Scanning Electron Microscopy
42%
Surface (Surface Science)
40%
Nucleation
40%
Electrical Breakdown
39%
Strength of Materials
38%
Void Growth
35%
Contact Resistance
34%
Three Dimensional Printing
34%
Silicon Nitride
34%
Thermal Stability
34%
Film
30%
Contact Area
30%
Oxidation Reaction
30%
Annealing
30%
Delamination
28%
Silicon Dioxide
28%
Sintering Temperature
27%
ZnO
26%
Transmission Electron Microscopy
26%
Thermal Conductivity
26%
Thermal Aging
24%
Phase Composition
24%
Palladium
24%
Silicide
24%
Superelasticity
23%
Corrosion
23%
Stereolithography
23%
Ceramic Substrate
22%
Surface Roughness
22%
Thermal Expansion
21%
Bonded Joint
21%
Sheet Molding Compounds
20%
Cathode
20%
Engineering
Interconnects
57%
Joints (Structural Components)
44%
Intermetallics
44%
Three Dimensional Integrated Circuits
40%
Metallizations
34%
Electromigration
30%
Shear Strength
28%
Nanowire
27%
Low-Temperature
26%
Dielectrics
25%
Thin Films
24%
Electronic Packaging
24%
Liquid Phase
22%
High Temperature Applications
22%
Bonding Temperature
21%
Decapsulation
20%
Test Structure
20%
Transients
20%
Microelectronics
19%
Bond Strength
18%
Melting Point
17%
Failure Analysis
17%
Aluminum Oxide
15%
Room Temperature
14%
Schottky Barrier
14%
Current Direction
13%
Annealing Temperature
13%
Nanoparticle
13%
Direct Current
13%
Dopants
13%
Degradation Mechanism
13%
Pulsed Laser
13%
Sheet Molding Compounds
13%
Contact Area
13%
Experimental Characterization
13%
Nanomaterial
13%
Threading Dislocation
13%
Failure Behavior
13%
Three Dimensional Printing
13%
Copper Wire
13%
Thermocompression Bonding
13%
Energy Engineering
11%
Eutectics
10%
Thermal Conductivity
10%
Bonding Wire
10%
Gold Wire
10%
Line Resistance
9%
Engineering
9%
Barrier Layer
9%
Crystallization Point
9%
Keyphrases
Electromigration
25%
3D IC
18%
Through Silicon via
15%
Interconnected Systems
13%
Dielectric Breakdown
13%
Near-field Optical
13%
Thermal Shield
13%
AlGaN-GaN
13%
Shielding Layer
13%
GaN-on-Si
13%
High Electron Mobility Transistor
13%
Cu-Cu
13%
Contact Resistance
13%
Bonded Interface
13%
Resistance Reduction
13%
Cu Protrusion
13%
Direct Current
9%
Cu TSV
9%
Cu-Cu Bonding
9%
Silicon Oxycarbide (SiOC)
9%
Silicon Nitride
9%
Cu Interconnect
8%
Annealing
7%
Protrusion
7%
SiOCH
6%
Fault Attack
6%
Hollow Truss
6%
Laser Ablated
6%
Thermal via
6%
Flip-flop
6%
Cryptographic
6%
Bit-flipping
6%
Iron Oxide
6%
Extrusion Failure
6%
Die Attachment
6%
Eutectic Solder Alloys
6%
Enhanced Photoluminescence
6%
FeOOH
6%
Silicide Nanowires
6%
Depth of Focus
6%
CoWP
6%
Decapsulation
6%
Vertical Silicon Nanowire
6%
Co Interconnects
6%
Laser Focusing
6%
Depth Adaptation
6%
Picosecond Laser
6%
Packaging Effect
6%
Size Comparison
6%
EEPROM
6%
