Material Science
Density
100%
Silicon
93%
Electronic Circuit
93%
Intermetallics
87%
Shape Memory
82%
Nanowire
82%
Nanoparticle
82%
Thin Films
81%
Aluminum Oxide
74%
Shear Strength
65%
Transistor
51%
Zirconia
50%
Oxide Compound
47%
Aluminum
45%
Dielectric Material
44%
Nanostructure
44%
Electron Mobility
44%
Scanning Electron Microscopy
44%
Surface (Surface Science)
42%
Nucleation
41%
Electrical Breakdown
41%
Strength of Materials
40%
Void Growth
36%
Contact Resistance
35%
Thermal Stability
35%
Film
31%
Contact Area
31%
Oxidation Reaction
31%
Annealing
31%
Delamination
29%
Silicon Dioxide
29%
Three Dimensional Printing
28%
Silicon Nitride
28%
Sintering Temperature
28%
ZnO
27%
Thermal Conductivity
26%
Thermal Aging
25%
Phase Composition
25%
Palladium
25%
Silicide
25%
Superelasticity
24%
Corrosion
24%
Stereolithography
23%
Transmission Electron Microscopy
23%
Ceramic Substrate
23%
Surface Roughness
23%
Thermal Expansion
22%
Bonded Joint
22%
Sheet Molding Compounds
21%
Cathode
21%
Engineering
Interconnects
59%
Joints (Structural Components)
46%
Intermetallics
46%
Three Dimensional Integrated Circuits
41%
Metallizations
35%
Electromigration
31%
Shear Strength
29%
Nanowire
28%
Low-Temperature
26%
Dielectrics
26%
Thin Films
25%
Electronic Packaging
24%
Liquid Phase
23%
High Temperature Applications
23%
Bonding Temperature
22%
Decapsulation
21%
Test Structure
21%
Transients
21%
Microelectronics
20%
Bond Strength
19%
Melting Point
18%
Failure Analysis
18%
Aluminum Oxide
15%
Room Temperature
15%
Schottky Barrier
14%
Current Direction
14%
Annealing Temperature
14%
Nanoparticle
14%
Direct Current
14%
Dopants
14%
Degradation Mechanism
14%
Pulsed Laser
14%
Sheet Molding Compounds
14%
Contact Area
14%
Experimental Characterization
14%
Nanomaterial
14%
Threading Dislocation
14%
Copper Wire
14%
Thermocompression Bonding
13%
Energy Engineering
12%
Eutectics
10%
Thermal Conductivity
10%
Bonding Wire
10%
Gold Wire
10%
Line Resistance
9%
Engineering
9%
Barrier Layer
9%
Crystallization Point
9%
Scanning Electron Microscope
9%
Physical Vapor Deposition
8%
Keyphrases
Electromigration
26%
3D IC
19%
Through Silicon via
16%
Interconnected Systems
14%
Dielectric Breakdown
14%
Near-field Optical
14%
Thermal Shield
14%
AlGaN-GaN
14%
Shielding Layer
14%
GaN-on-Si
14%
High Electron Mobility Transistor
14%
Cu-Cu
14%
Contact Resistance
14%
Bonded Interface
14%
Resistance Reduction
14%
Cu Protrusion
14%
Direct Current
10%
Cu TSV
9%
Cu-Cu Bonding
9%
Silicon Oxycarbide (SiOC)
9%
Silicon Nitride
9%
Cu Interconnect
8%
Annealing
8%
Protrusion
7%
SiOCH
7%
Fault Attack
7%
Hollow Truss
7%
Laser Ablated
7%
Thermal via
7%
Flip-flop
7%
Cryptographic
7%
Bit-flipping
7%
Iron Oxide
7%
Extrusion Failure
7%
Die Attachment
7%
Eutectic Solder Alloys
7%
Enhanced Photoluminescence
7%
FeOOH
7%
Silicide Nanowires
7%
Depth of Focus
7%
CoWP
7%
Decapsulation
7%
Vertical Silicon Nanowire
7%
Co Interconnects
7%
Laser Focusing
7%
Depth Adaptation
7%
Picosecond Laser
7%
Packaging Effect
7%
Size Comparison
7%
EEPROM
7%