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Adhesion studies of Ta/low-k (black diamond) interface using thermocompressive wafer bonding and four-point bend
W. H. Teh*, C. F. Tsang, A. Trigg, K. W. Teoh, R. Kumar, N. Balasubramanian, D. L. Kwong, S. E. Ong, Farah Malik, C. L. Gan
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
8
Citations
(Scopus)