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Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds
H. Xu*, C. Liu, V. V. Silberschmidt, S. S. Pramana, T. J. White, Z. Chen, V. L. Acoff
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
234
Citations
(Scopus)