Characterization of the Young's modulus, residual stress and fracture strength of Cu-Sn-In thin films using combinatorial deposition and micro-cantilevers

Wardhana A. Sasangka, Chee Lip Gan, Donny Lai, Chuan Seng Tan, Carl V. Thompson

Research output: Contribution to journal › Article › peer-review

14 Citations (Scopus)

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Material Science

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Engineering