Deposition of (Ti, Al)N films by filtered cathodic vacuum arc

Engineering

• Internal Stress 100%
• Young's Modulus 66%
• Deposited Film 66%
• Atomic Force Microscopy 33%
• Partial Pressure 33%
• Ray Diffraction 33%
• Crystal Structure 33%
• Nitride 33%
• Microhardness 33%
• Face-Centered Cubic 33%
• Preferred Orientation 33%
• Metal Phase 33%
• Porous Film 33%

Material Science

• Film 100%
• Young's Modulus 18%
• Microhardness 9%
• Crystal Structure 9%
• X-Ray Diffraction 9%
• Surface Roughness 9%
• Nitride Compound 9%

Keyphrases

• Variation Trend 14%
• Stress Property 14%