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Design for manufacturability and its role in enhancing stress migration reliability of porous ultra low-k copper interconnects
Y. K. Lim*, K. L. Pey, P. S. Lee, Y. H. Lee, N. R. Kamat, J. B. Tan, Thomas Fu, L. C. Hsia
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
7
Citations
(Scopus)