Fingerprint
Dive into the research topics of 'Direct evidence of electromigration failure mechanism in dual-damascene Cu interconnect tree structures'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Direct evidence of electromigration failure mechanism in dual-damascene Cu interconnect tree structures
A. V. Vairagar*, S. G. Mhaisalkar, M. A. Meyer, E. Zschech, Ahila Krishnamoorthy, K. N. Tu, A. M. Gusak
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
24
Citations
(Scopus)