Fingerprint
Dive into the research topics of 'Effect of Cu3 Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Effect of Cu3 Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects
M. Y. Yan*, J. O. Suh, F. Ren, K. N. Tu, A. V. Vairagar, S. G. Mhaisalkar, Ahila Krishnamoorthy
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
29
Citations
(Scopus)