Effect of electric current on the mechanical properties and interfacial microstructure of Ni-P/Sn-3.5Ag and Ni/Sn-3.5Ag solder joints

Aditya Kumar*, Zhong Chen, C. C. Wong, S. G. Mhaisalkar, Vaidhyanathan Kripesh

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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Engineering

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Chemical Engineering

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