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Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects
C. W. Chang*, C. V. Thompson, C. L. Gan, K. L. Pey, W. K. Choi, Y. K. Lim
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
18
Citations
(Scopus)