Fingerprint
Dive into the research topics of 'Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnects'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnects
H. L. Leong, C. L. Gan, R. I. Made, C. V. Thompson, K. L. Pey, H. Y. Li
Research output: Contribution to journal › Article › peer-review
16
Citations
(Scopus)