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Growth and fabrication of carbon-based three-dimensional heterostructure in through-silicon vias (TSVs) for 3D interconnects
Ye Zhu, Chong Wei Tan, Shen Lin Chua, Yu Dian Lim, Beng Kang Tay, Chuan Seng Tan
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
4
Citations
(Scopus)