High aspect ratio silicon nanomoulds for UV embossing fabricated by directional thermal oxidation using an oxidation mask

Keyphrases

• Nanomolds 100%
• Silicon Etching 100%
• Teflon 50%
• Cross-sectional Shape 50%
• Oxide Growth 50%
• Large-area Patterning 50%
• Mask Layer 50%
• Pre-oxidation 50%
• Silicon Metal 50%
• Nanomolding 50%
• Parallel Technique 50%
• Nanoembossing 50%
• Etching Depth 50%
• Masking Scheme 50%
• Rectangular Channel 50%
• Metal Mask 50%
• Depth-time 50%

Material Science

• Oxidation Reaction 100%
• Silicon 100%
• Oxide Compound 12%
• Silicon Nitride 12%