High thermal conductivity ceramic layered system substrates for microelectronic applications

Engineering

• Aluminum Oxide 100%
• Dielectrics 100%
• Microelectronics 100%
• High Thermal Conductivity 100%
• Energy Engineering 50%
• Thickness Ratio 50%
• Thermal Conductivity 50%
• Interlayer 50%
• Substrate Material 50%
• Conductive 50%
• Amorphous Phase 50%
• Layer Thickness 50%

Material Science

• Thermal Conductivity 100%
• Carbon Fiber 100%
• Aluminum Oxide 40%
• Dielectric Property 40%
• Thermal Property 40%

Keyphrases

• Optimum Configuration 20%
• Thermal Conductive 20%
• High-performance Processors 20%
• Layer Thickness Ratio 20%
• Insulating Properties 20%
• Alumina Matrix 20%