In-situ studies and Monte Carlo simulation of electromigration-induced void evolution in dual in-laid Cu interconnect structures for several geometries

A. V. Vairagar*, M. A. Meyer, E. Zschech, W. Shao, S. G. Mhaisalkar, A. M. Gusak, K. N. Tu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

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Material Science

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