Fingerprint
Dive into the research topics of 'Investigation of cure kinetics and its effect on adhesion strength of nonconductive adhesives used in flip chip assembly'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Investigation of cure kinetics and its effect on adhesion strength of nonconductive adhesives used in flip chip assembly
Ho Yu*, S. G. Mhaisalkar, E. H. Wong, L. K. Teh, C. C. Wong
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
18
Citations
(Scopus)