Investigation of intrinsic dielectric breakdown mechanism in Cu/low-κ interconnect system

Nam Hwang*, Tam Lyn Tan, Cheng Kuo Cheng, Anyan Du, Chee Lip Gan, Kin Leong Pey

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

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Material Science

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Engineering