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Microstructure, joint strength and failure mechanism of Sn-Ag, Sn-Ag-Cu versus Sn-Pb-Ag solders in BGA packages
Ka Yau Lee, Ming Li, Dennis R. Olsen, William T. Chen, Ben T.C. Tan, Subodh Mhaisalkar
Research output: Contribution to journal › Article › peer-review
55
Citations
(Scopus)