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Microstructure, joint strength and failure mechanisms of SnPb and Pb-free solders in BGA packages
Ming Li*, K. Y. Lee, D. R. Olsen, William T. Chen, Ben Tin Chong Tan, Subodh Mhaisalkar
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
87
Citations
(Scopus)