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Mitigating the Overheat of Stretchable Electronic Devices Via High-Enthalpy Thermal Dissipation of Hydrogel Encapsulation
Can Cao, Shaobo Ji*, Ying Jiang, Jiangtao Su, Huarong Xia, Haicheng Li, Changhao Tian, Yi Jing Wong, Xue Feng*, Xiaodong Chen*
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
11
Citations
(Scopus)