Next-generation Packaging Enabled by an Engineered Copper Nanomaterial

Keyphrases

• Thermal via 100%
• Heat Spreader 100%
• Copper Nanomaterials 100%
• Copper Joints 50%
• Hot Press Molding 50%
• Solder Paste 50%
• Soldering Temperature 50%
• Copper System 50%
• Thermal Demand 50%
• Al-SiC 50%
• High Power Devices 50%
• Intermetallic Formation 50%
• Thermal Load 50%
• Spreader 50%
• Circuit Board 50%
• Thermal Profile 50%
• Electroplated Copper 50%
• Reflow Oven 50%

Engineering

• Nanomaterial 100%
• Hot Pressing 100%
• Interconnects 50%
• Joints (Structural Components) 50%
• Thermal Load 50%
• Thermal Conductivity 50%
• Open Circuit 50%
• Injection Moulding 50%
• Sintering 50%
• High Thermal Conductivity 50%
• Intermetallics 50%
• Failure Mode 50%
• Power Device 50%
• Side Wall 50%
• High Electrical Conductivity 50%
• Electrical Load 50%
• Near Net Shape 50%

Material Science

• Nanostructured Material 100%
• Thermal Conductivity 100%
• Hot Pressing 100%
• Electronic Circuit 50%
• Surface (Surface Science) 50%
• Sintering 50%
• Electrical Conductivity 50%
• Silver 50%
• Intermetallics 50%
• Injection Molding 50%
• Power Device 50%