Novel high temperature polymeric encapsulation material for extreme environment electronics packaging

Eric Jian Rong Phua, Ming Liu, Bokun Cho, Qing Liu, Shahrouz Amini, Xiao Hu, Chee Lip Gan*

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

45 Citations (Scopus)

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Material Science

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