Numerical analyses of peel demolding for UV embossing of high aspect ratio micro-patterning

L. P. Yeo, S. C. Joshi, Y. C. Lam, Mary B. Chan-Park, D. E. Hardt

Research output: Contribution to journalArticlepeer-review

15 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Numerical analyses of peel demolding for UV embossing of high aspect ratio micro-patterning'. Together they form a unique fingerprint.

Keyphrases

Material Science

Engineering