Structural and electrical properties of copper thin films prepared by filtered cathodic vacuum arc technique

Keyphrases

• Structural Properties 100%
• Electrical Properties 100%
• Filtered Cathodic Vacuum Arc 100%
• Arc Technique 100%
• Copper Film 100%
• Atomic Force Microscopy 33%
• Room Temperature 33%
• X Ray Diffraction 33%
• Grain Size 33%
• Electrical Conductivity 33%
• Low Resistivity 33%
• Polycrystalline Structure 33%
• Film Thickness 33%
• Diffraction Force 33%
• Lateral Size 33%
• RMS Roughness 33%
• Critical Film Thickness 33%

Material Science

• Electrical Resistivity 100%
• Film 100%
• Thin Films 100%
• Film Thickness 100%
• X-Ray Diffraction 50%
• Grain Size 50%