Tape casting of high dielectric ceramic substrates for microelectronics packaging

A. I.Y. Tok*, F. Y.C. Boey, M. K.A. Khor

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

17 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Tape casting of high dielectric ceramic substrates for microelectronics packaging'. Together they form a unique fingerprint.

Material Science

Keyphrases

Engineering