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The effect of intermetallic bonding on blocking electromigration induced interfacial diffusion in Cu dual damascene interconnects
Minyu Yan*, Jong Ook Suh, King Ning Tu, Anand Vishwanath Vairagar, Subodh Gautam Mhaisalkar, Ahila Krishnamoorthy
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution