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The effect of stress migration on electromigration in dual damascene copper interconnects
A. Heryanto*, K. L. Pey, Y. K. Lim, W. Liu, N. Raghavan, J. Wei, C. L. Gan, M. K. Lim, J. B. Tan
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
20
Citations
(Scopus)