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UV activiated adhesive for aluminum bonded repairs
M. B. Chan-Park
*
, R. Haghiglat
*
Corresponding author for this work
SiPix Imaging, Inc.
Research output
:
Contribution to journal
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Article
›
peer-review
1
Citation (Scopus)
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Keyphrases
Bonded Repair
100%
Aluminum Substrate
100%
Curing Temperature
50%
Cationic Photoinitiator
50%
Storable
50%
Complete Cure
50%
Structural Adhesive
50%
Ferrocenium Salt
50%
Engineering
Bonded Repair
100%
Aluminum Substrate
100%
Ciba
50%
Structural Adhesive
50%
Curing Temperature
50%
Pharmacology, Toxicology and Pharmaceutical Science
Adhesive Agent
100%
Photoinitiator
50%
Table Salt
50%
Differential Scanning Calorimetry
50%
Lewis Acid
50%
Material Science
Aluminum
100%
Differential Scanning Calorimetry
33%
Shear Strength
33%
Chemistry
Shear Strength
33%
Photoinitiator
33%