TY - GEN
T1 - 25 to 300 degree celsius 80bps acoustic transmitter based on crystal-less temperature-independent frequency reference with differential modulation for drilling noise power cancellation
AU - Zhou, Lianhong
AU - Yao, Libin
AU - Heng, Chun Huat
AU - Annamalai, Muthukumaraswamy
AU - Je, Minkyu
AU - Han, Wei Kwang
AU - Kumar, Lakshmi Sutha
AU - Guan, Yong Liang
PY - 2013
Y1 - 2013
N2 - An acoustic transmitter employing crystal-less temperature-independent frequency reference and differential modulation has been realized in 1um SOI CMOS process. A temperature-independent switched capacitor based FVC is incorporated within an FLL to provide a stable frequency reference, which in turns generates the acoustic carriers. Differential modulation is proposed to allow drilling noise power cancellation at the receiver end. The FLL generates 3.3MHz output with an inaccuracy less than 2.85% over temperature range of 25 to 300 degree Celsius using digital trimming. Consuming 11mW under 5V supply, the transmitter achieves a data rate of 80bps while occupying an area of 25mm 2.
AB - An acoustic transmitter employing crystal-less temperature-independent frequency reference and differential modulation has been realized in 1um SOI CMOS process. A temperature-independent switched capacitor based FVC is incorporated within an FLL to provide a stable frequency reference, which in turns generates the acoustic carriers. Differential modulation is proposed to allow drilling noise power cancellation at the receiver end. The FLL generates 3.3MHz output with an inaccuracy less than 2.85% over temperature range of 25 to 300 degree Celsius using digital trimming. Consuming 11mW under 5V supply, the transmitter achieves a data rate of 80bps while occupying an area of 25mm 2.
KW - Acoustic transmitter
KW - Differential modulation
KW - Frequency reference
KW - High temperature
UR - http://www.scopus.com/inward/record.url?scp=84893629309&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84893629309&partnerID=8YFLogxK
U2 - 10.1109/ASSCC.2013.6691080
DO - 10.1109/ASSCC.2013.6691080
M3 - Conference contribution
AN - SCOPUS:84893629309
SN - 9781479902781
T3 - Proceedings of the 2013 IEEE Asian Solid-State Circuits Conference, A-SSCC 2013
SP - 453
EP - 456
BT - Proceedings of the 2013 IEEE Asian Solid-State Circuits Conference, A-SSCC 2013
T2 - 2013 9th IEEE Asian Solid-State Circuits Conference, A-SSCC 2013
Y2 - 11 November 2013 through 13 November 2013
ER -