A flexible polyimide cable for implantable neural probe arrays

Ming Yuan Cheng, Woo Tae Park*, Aibin Yu, Rui Feng Xue, Kwan Ling Tan, Daquan Yu, Sang Hyun Lee, Chee Lip Gan, Minkyu Je

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

13 Citations (Scopus)

Abstract

A flexible polyimide cable developed for implantable neural probe array application is presented. The flexible cable is used to connect two implantable platforms - one in direct touch with the brain containing a neural probe array and its interface IC, and the other on the skull including a wireless link IC, a coil and an antenna for power and data transfer through the transcutaneous link. The cable needs to be highly flexible to minimize post-insertion injury caused by the probe array in the presence of brain micro-motion. Polyimide is used to form a flexible substrate and an insulator layer of the cable. For the advanced neural recording system, a large amount of neural recording data has to be communicated between the two platforms through the flexible cable. High-rate data transmission performance of the fabricated flexible cable is characterized and discussed. The measured insertion loss (IL) of the flexible cable is less than 3 dB and the isolation between two adjacent interconnects is better than 17 dB up to 2 GHz. The data transmission through the flexible cable is verified to be highly reliable at 100 Mbps. For surgical manipulation and long term implantation of the neural probe microsystem, the flexible cable needs to have excellent mechanical strength and resistance to fatigue. The mechanical characteristics and fatigue strength of the flexible cable are also measured and discussed. The measured maximum tensile stress and strain of the flexible cable before failure are 251.2 ± 7.1 MPa (14.35 ± 0.3 N) and 4.16 ± 0.11 %, respectively. The Young's modulus of the fabricated flexible cable is 8.21 GPa. From the fatigue strength testing, the measured resistance change of the flexible cable's interconnect is less than 4.8 % after 250,000 cycles of cyclic mechanical stretch.

Original languageEnglish
Pages (from-to)1111-1118
Number of pages8
JournalMicrosystem Technologies
Volume19
Issue number8
DOIs
Publication statusPublished - Aug 2013
Externally publishedYes

ASJC Scopus Subject Areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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