A halogen-free epoxy with intrinsic flame retardance for use in electronic packaging

Song Kiat Jacob Lim; Jian Rong Eric Phua; Yu Bai; Xiao Hu; Chee Lip Gan

doi:10.1109/EPTC.2016.7861500

A halogen-free epoxy with intrinsic flame retardance for use in electronic packaging

Song Kiat Jacob Lim, Jian Rong Eric Phua, Yu Bai, Xiao Hu, Chee Lip Gan^*

^*Corresponding author for this work

Nanyang Technological University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Typical epoxy-based electronic packaging materials necessitate substantial inclusion of flame retardant additives in order to satisfy regulatory requirements regarding flammability, usually evaluated by the UL-94 flammability test. Conventional additives such as encapsulated red phosphorus may pose a reliability issue under high humidity environment due to its hygroscopic nature, leading to electrical shorts caused by electrochemical migration. A non-halogenated epoxy based on the Polyhedral Oligomeric Silsesquioxane (POSS) structure possess inherent flame retardance and excellent high temperature properties. This study investigate the feasibility of utilizing POSS-based epoxy to replace conventional epoxies as an intrinsically flame retardant electronic packaging materials with enhanced reliability.

Original language	English
Title of host publication	Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	337-341
Number of pages	5
ISBN (Electronic)	9781509043682
DOIs	https://doi.org/10.1109/EPTC.2016.7861500
Publication status	Published - Feb 21 2017
Externally published	Yes
Event	18th IEEE Electronics Packaging Technology Conference, EPTC 2016 - Singapore, Singapore Duration: Nov 30 2016 → Dec 3 2016

Publication series

Name	Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016

Conference

Conference	18th IEEE Electronics Packaging Technology Conference, EPTC 2016
Country/Territory	Singapore
City	Singapore
Period	11/30/16 → 12/3/16

Bibliographical note

Publisher Copyright:
© 2016 IEEE.

ASJC Scopus Subject Areas

Electrical and Electronic Engineering
Ceramics and Composites
Electronic, Optical and Magnetic Materials
Metals and Alloys

Access to Document

10.1109/EPTC.2016.7861500

Cite this

Lim, S. K. J., Phua, J. R. E., Bai, Y., Hu, X., & Gan, C. L. (2017). A halogen-free epoxy with intrinsic flame retardance for use in electronic packaging. In Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016 (pp. 337-341). Article 7861500 (Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2016.7861500

Lim, Song Kiat Jacob ; Phua, Jian Rong Eric ; Bai, Yu et al. / A halogen-free epoxy with intrinsic flame retardance for use in electronic packaging. Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 337-341 (Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016).

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abstract = "Typical epoxy-based electronic packaging materials necessitate substantial inclusion of flame retardant additives in order to satisfy regulatory requirements regarding flammability, usually evaluated by the UL-94 flammability test. Conventional additives such as encapsulated red phosphorus may pose a reliability issue under high humidity environment due to its hygroscopic nature, leading to electrical shorts caused by electrochemical migration. A non-halogenated epoxy based on the Polyhedral Oligomeric Silsesquioxane (POSS) structure possess inherent flame retardance and excellent high temperature properties. This study investigate the feasibility of utilizing POSS-based epoxy to replace conventional epoxies as an intrinsically flame retardant electronic packaging materials with enhanced reliability.",

author = "Lim, {Song Kiat Jacob} and Phua, {Jian Rong Eric} and Yu Bai and Xiao Hu and Gan, {Chee Lip}",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 18th IEEE Electronics Packaging Technology Conference, EPTC 2016 ; Conference date: 30-11-2016 Through 03-12-2016",

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doi = "10.1109/EPTC.2016.7861500",

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series = "Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016",

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Lim, SKJ, Phua, JRE, Bai, Y, Hu, X & Gan, CL 2017, A halogen-free epoxy with intrinsic flame retardance for use in electronic packaging. in Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016., 7861500, Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016, Institute of Electrical and Electronics Engineers Inc., pp. 337-341, 18th IEEE Electronics Packaging Technology Conference, EPTC 2016, Singapore, Singapore, 11/30/16. https://doi.org/10.1109/EPTC.2016.7861500

A halogen-free epoxy with intrinsic flame retardance for use in electronic packaging. / Lim, Song Kiat Jacob; Phua, Jian Rong Eric; Bai, Yu et al.
Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Institute of Electrical and Electronics Engineers Inc., 2017. p. 337-341 7861500 (Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AB - Typical epoxy-based electronic packaging materials necessitate substantial inclusion of flame retardant additives in order to satisfy regulatory requirements regarding flammability, usually evaluated by the UL-94 flammability test. Conventional additives such as encapsulated red phosphorus may pose a reliability issue under high humidity environment due to its hygroscopic nature, leading to electrical shorts caused by electrochemical migration. A non-halogenated epoxy based on the Polyhedral Oligomeric Silsesquioxane (POSS) structure possess inherent flame retardance and excellent high temperature properties. This study investigate the feasibility of utilizing POSS-based epoxy to replace conventional epoxies as an intrinsically flame retardant electronic packaging materials with enhanced reliability.

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Lim SKJ, Phua JRE, Bai Y, Hu X , Gan CL. A halogen-free epoxy with intrinsic flame retardance for use in electronic packaging. In Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Institute of Electrical and Electronics Engineers Inc. 2017. p. 337-341. 7861500. (Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016). doi: 10.1109/EPTC.2016.7861500

A halogen-free epoxy with intrinsic flame retardance for use in electronic packaging

Abstract

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Bibliographical note

ASJC Scopus Subject Areas

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