A Mechanically Interlocking Strategy Based on Conductive Microbridges for Stretchable Electronics

Ming Zhu, Shaobo Ji, Yifei Luo, Feilong Zhang, Zhihua Liu, Changxian Wang, Zhisheng Lv, Ying Jiang, Ming Wang, Zequn Cui, Guanglin Li, Longtao Jiang*, Zhiyuan Liu*, Xiaodong Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

55 Citations (Scopus)

Abstract

Stretchable electronics incorporating critical sensing, data transmission, display and powering functionalities, is crucial to emerging wearable healthcare applications. To date, methods to achieve stretchability of individual functional devices have been extensively investigated. However, integration strategies of these stretchable devices to achieve all-stretchable systems are still under exploration, in which the reliable stretchable interconnection is a key element. Here, solderless stretchable interconnections based on mechanically interlocking microbridges are developed to realize the assembly of individual stretchable devices onto soft patternable circuits toward multifunctional all-stretchable platforms. This stretchable interconnection can effectively bridge interlayer conductivity with tight adhesion through both conductive microbridges and selectively distributed adhesive polymer. Consequently, enhanced stretchability up to a strain of 35% (R/R0 ≤ 5) is shown, compared with conventional solder-assisted connections which lose electrical conduction at a strain of less than 5% (R/R0 ≈ 30). As a proof of concept, a self-powered all-stretchable data-acquisition platform is fabricated by surface mounting a stretchable strain sensor and a supercapacitor onto a soft circuit through solderless interconnections. This solderless interconnecting strategy for surface-mountable devices can be utilized as a valuable technology for the integration of stretchable devices to achieve all-soft multifunctional systems.

Original languageEnglish
Article number2101339
JournalAdvanced Materials
Volume34
Issue number7
DOIs
Publication statusPublished - Feb 17 2022
Externally publishedYes

Bibliographical note

Publisher Copyright:
© 2022 Wiley-VCH GmbH

ASJC Scopus Subject Areas

  • General Materials Science
  • Mechanics of Materials
  • Mechanical Engineering

Keywords

  • all-stretchable platforms
  • healthcare electronics
  • interlocking structures
  • stretchable electronics packaging
  • stretchable interconnections

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