A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads

H. Xu; C. Liu; V. V. Silberschmidt; S. S. Pramana; T. J. White; Z. Chen

doi:10.1016/j.scriptamat.2009.03.034

A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads

H. Xu^*, C. Liu, V. V. Silberschmidt, S. S. Pramana, T. J. White, Z. Chen

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

100 Citations (Scopus)

Abstract

The nanoscale interfacial characteristics of thermosonic copper ball bonding on aluminium metallization were investigated. It was found that ultrasonic vibration swept oxides of aluminium and copper from parts of the contact area, promoting the formation of intermetallic compound Al₂Cu (approx.20 nm thick). Where oxides persisted, an amorphous aluminium oxide layer connected with a crystalline copper oxide. It was estimated that ultrasonic vibration caused an effective local temperature increase to 465 °C that accelerated interdiffusion and enhanced the formation of Cu-Al intermetallics.

Original language	English
Pages (from-to)	165-168
Number of pages	4
Journal	Scripta Materialia
Volume	61
Issue number	2
DOIs	https://doi.org/10.1016/j.scriptamat.2009.03.034
Publication status	Published - Jul 2009
Externally published	Yes

ASJC Scopus Subject Areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

Keywords

Interfacial structure
Intermetallic compounds
Thermosonic bonding mechanism

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10.1016/j.scriptamat.2009.03.034

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title = "A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads",

abstract = "The nanoscale interfacial characteristics of thermosonic copper ball bonding on aluminium metallization were investigated. It was found that ultrasonic vibration swept oxides of aluminium and copper from parts of the contact area, promoting the formation of intermetallic compound Al2Cu (approx.20 nm thick). Where oxides persisted, an amorphous aluminium oxide layer connected with a crystalline copper oxide. It was estimated that ultrasonic vibration caused an effective local temperature increase to 465 °C that accelerated interdiffusion and enhanced the formation of Cu-Al intermetallics.",

keywords = "Interfacial structure, Intermetallic compounds, Thermosonic bonding mechanism",

author = "H. Xu and C. Liu and Silberschmidt, {V. V.} and Pramana, {S. S.} and White, {T. J.} and Z. Chen",

year = "2009",

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T1 - A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads

AU - Xu, H.

AU - Liu, C.

AU - Silberschmidt, V. V.

AU - Pramana, S. S.

AU - White, T. J.

AU - Chen, Z.

PY - 2009/7

Y1 - 2009/7

N2 - The nanoscale interfacial characteristics of thermosonic copper ball bonding on aluminium metallization were investigated. It was found that ultrasonic vibration swept oxides of aluminium and copper from parts of the contact area, promoting the formation of intermetallic compound Al2Cu (approx.20 nm thick). Where oxides persisted, an amorphous aluminium oxide layer connected with a crystalline copper oxide. It was estimated that ultrasonic vibration caused an effective local temperature increase to 465 °C that accelerated interdiffusion and enhanced the formation of Cu-Al intermetallics.

AB - The nanoscale interfacial characteristics of thermosonic copper ball bonding on aluminium metallization were investigated. It was found that ultrasonic vibration swept oxides of aluminium and copper from parts of the contact area, promoting the formation of intermetallic compound Al2Cu (approx.20 nm thick). Where oxides persisted, an amorphous aluminium oxide layer connected with a crystalline copper oxide. It was estimated that ultrasonic vibration caused an effective local temperature increase to 465 °C that accelerated interdiffusion and enhanced the formation of Cu-Al intermetallics.

KW - Interfacial structure

KW - Intermetallic compounds

KW - Thermosonic bonding mechanism

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DO - 10.1016/j.scriptamat.2009.03.034

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SP - 165

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JO - Scripta Materialia

JF - Scripta Materialia

IS - 2

ER -

A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads

Abstract

ASJC Scopus Subject Areas

Keywords

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