Fingerprint
Dive into the research topics of 'A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads
H. Xu*, C. Liu, V. V. Silberschmidt, S. S. Pramana, T. J. White, Z. Chen
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
100
Citations
(Scopus)