A viscoplastic constitutive model for 63Sn37Pb eutectic solders

Sung Yi; Guangxing Luo; Kerm Sin Chian; William T. Chen

doi:10.1109/EMAP.2000.904151

A viscoplastic constitutive model for 63Sn37Pb eutectic solders

Sung Yi^*, Guangxing Luo, Kerm Sin Chian, William T. Chen

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

In the present study, a new constitutive model for eutectic solders (63Sn37Pb) is proposed. Grain sizes and phase sizes are considered as the coarsening is one of main reasons to failure of solder joints. The present model has been developed based on the combination of grain boundary sliding and matrix dislocation deformation mechanisms in order to describe a thermo-mechanical behavior of eutectic solders. Internal stress tensors are also introduced to describe the transient behaviors during the tensile test and first stage creep. A series of tensile tests, creep and creep recover tests were conducted at temperature range from-10 to 100°C. The specimens with two different phase sizes were tested. Good agreements were obtained between the experimental results and the model.

Original language	English
Title of host publication	International Symposium on Electronic Materials and Packaging, EMAP 2000
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	183-190
Number of pages	8
ISBN (Electronic)	0780366549, 9780780366541
DOIs	https://doi.org/10.1109/EMAP.2000.904151
Publication status	Published - 2000
Externally published	Yes
Event	International Symposium on Electronic Materials and Packaging, EMAP 2000 - Hong Kong, China Duration: Nov 30 2000 → Dec 2 2000

Publication series

Name	International Symposium on Electronic Materials and Packaging, EMAP 2000

Conference

Conference	International Symposium on Electronic Materials and Packaging, EMAP 2000
Country/Territory	China
City	Hong Kong
Period	11/30/00 → 12/2/00

Bibliographical note

Publisher Copyright:
© 2000 IEEE.

ASJC Scopus Subject Areas

General Engineering

Access to Document

10.1109/EMAP.2000.904151

Cite this

Yi, S., Luo, G., Chian, K. S., & Chen, W. T. (2000). A viscoplastic constitutive model for 63Sn37Pb eutectic solders. In International Symposium on Electronic Materials and Packaging, EMAP 2000 (pp. 183-190). Article 904151 (International Symposium on Electronic Materials and Packaging, EMAP 2000). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMAP.2000.904151

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title = "A viscoplastic constitutive model for 63Sn37Pb eutectic solders",

abstract = "In the present study, a new constitutive model for eutectic solders (63Sn37Pb) is proposed. Grain sizes and phase sizes are considered as the coarsening is one of main reasons to failure of solder joints. The present model has been developed based on the combination of grain boundary sliding and matrix dislocation deformation mechanisms in order to describe a thermo-mechanical behavior of eutectic solders. Internal stress tensors are also introduced to describe the transient behaviors during the tensile test and first stage creep. A series of tensile tests, creep and creep recover tests were conducted at temperature range from-10 to 100°C. The specimens with two different phase sizes were tested. Good agreements were obtained between the experimental results and the model.",

author = "Sung Yi and Guangxing Luo and Chian, \{Kerm Sin\} and Chen, \{William T.\}",

note = "Publisher Copyright: {\textcopyright} 2000 IEEE.; International Symposium on Electronic Materials and Packaging, EMAP 2000 ; Conference date: 30-11-2000 Through 02-12-2000",

year = "2000",

doi = "10.1109/EMAP.2000.904151",

language = "English",

series = "International Symposium on Electronic Materials and Packaging, EMAP 2000",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "183--190",

booktitle = "International Symposium on Electronic Materials and Packaging, EMAP 2000",

address = "United States",

}

Yi, S, Luo, G, Chian, KS & Chen, WT 2000, A viscoplastic constitutive model for 63Sn37Pb eutectic solders. in International Symposium on Electronic Materials and Packaging, EMAP 2000., 904151, International Symposium on Electronic Materials and Packaging, EMAP 2000, Institute of Electrical and Electronics Engineers Inc., pp. 183-190, International Symposium on Electronic Materials and Packaging, EMAP 2000, Hong Kong, China, 11/30/00. https://doi.org/10.1109/EMAP.2000.904151

A viscoplastic constitutive model for 63Sn37Pb eutectic solders. / Yi, Sung; Luo, Guangxing; Chian, Kerm Sin et al.
International Symposium on Electronic Materials and Packaging, EMAP 2000. Institute of Electrical and Electronics Engineers Inc., 2000. p. 183-190 904151 (International Symposium on Electronic Materials and Packaging, EMAP 2000).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - A viscoplastic constitutive model for 63Sn37Pb eutectic solders

AU - Yi, Sung

AU - Luo, Guangxing

AU - Chian, Kerm Sin

AU - Chen, William T.

PY - 2000

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N2 - In the present study, a new constitutive model for eutectic solders (63Sn37Pb) is proposed. Grain sizes and phase sizes are considered as the coarsening is one of main reasons to failure of solder joints. The present model has been developed based on the combination of grain boundary sliding and matrix dislocation deformation mechanisms in order to describe a thermo-mechanical behavior of eutectic solders. Internal stress tensors are also introduced to describe the transient behaviors during the tensile test and first stage creep. A series of tensile tests, creep and creep recover tests were conducted at temperature range from-10 to 100°C. The specimens with two different phase sizes were tested. Good agreements were obtained between the experimental results and the model.

AB - In the present study, a new constitutive model for eutectic solders (63Sn37Pb) is proposed. Grain sizes and phase sizes are considered as the coarsening is one of main reasons to failure of solder joints. The present model has been developed based on the combination of grain boundary sliding and matrix dislocation deformation mechanisms in order to describe a thermo-mechanical behavior of eutectic solders. Internal stress tensors are also introduced to describe the transient behaviors during the tensile test and first stage creep. A series of tensile tests, creep and creep recover tests were conducted at temperature range from-10 to 100°C. The specimens with two different phase sizes were tested. Good agreements were obtained between the experimental results and the model.

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BT - International Symposium on Electronic Materials and Packaging, EMAP 2000

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A viscoplastic constitutive model for 63Sn37Pb eutectic solders

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ASJC Scopus Subject Areas

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