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Advanced STI technology with void free gap-fill and superior device performance for 45nm devices
H. Liu*, L. Wong, W. Lu, Z. G. Sun, I. Bangun, Y. P. Shen, Y. P. Wu, Z. Chen, M. S. Zhou, T. Chu, R. Leong, A. Jain, C. Ching, K. Raguputhi, H. Whitesell, J. Kasim, Z. Shen
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2
Citations
(Scopus)