@inproceedings{3583ad05c0014fb8932dbda4982ee414,
title = "Alternative lapping method to reduce edge rounding effect",
abstract = "Polishing is a simple and direct method to prepare samples for failure analysis and characterization. However, polishing commonly gives rise to the issue of rounding at the sample's corners and edges. This is believed to have arisen from the uneven distribution of polishing slurry between the edges and sample surface during polishing. Thus, we propose a new lapping method to reduce the rounding effect. From our experiments, negligible rounding effect was observed on a 9 mm by 7 mm die after a depth of ∼ 2 μm of material was removed using our proposed alternative lapping method.",
author = "Ong, \{Hock Guan\} and Gan, \{Chee Lip\}",
year = "2012",
language = "English",
isbn = "9781615039791",
series = "Conference Proceedings from the International Symposium for Testing and Failure Analysis",
publisher = "ASM International",
pages = "462--464",
booktitle = "ISTFA 2012 - Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis",
address = "United States",
note = "38th International Symposium for Testing and Failure Analysis, ISTFA 2012 ; Conference date: 11-11-2012 Through 15-11-2012",
}