Analytical modeling of reservoir effect on electromigration in Cu interconnects

Zhenghao Gan*, A. M. Gusak, W. Shao, Zhong Chen, S. G. Mhaisalkar, T. Zaporozhets, K. N. Tu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Analytical modeling of reservoir effect on electromigration in Cu interconnects'. Together they form a unique fingerprint.

Material Science

Keyphrases

Chemistry

Engineering