Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts

Vinod K. Murugan; Zhigang Jia; Govindo J. Syaranamual; Chee Lip Gan; Yizhong Huang; Zhong Chen

doi:10.1016/j.microrel.2016.02.014

Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts

Vinod K. Murugan, Zhigang Jia, Govindo J. Syaranamual, Chee Lip Gan, Yizhong Huang, Zhong Chen^*

^*Corresponding author for this work

Nanyang Technological University

Research output: Contribution to journal › Article › peer-review

13 Citations (Scopus)

Abstract

Atmospheric corrosion has vast consequences on the reliability of electronic connectors. This study determined the corrosion resistance of Ni/Ni-P plating metallurgy as a function of plating current density and plating thickness. Discrepancy was observed in the neutral salt spray (NSS) and mixed flowing gas (MFG) tests. Thicker Ni-P deposits displayed superior corrosion resistance in MFG tests while thinner Ni-P deposits performed better in NSS tests. This disparity was attributed to the intrinsic corrosion susceptibility of Ni-P against chlorine or sulfur assisted corrosion. Corrosion products were analysed for better understanding of the corrosion mechanism. NSS test produced green corrosion residues consisting of CuCl (nantokite) and CuCl₂(OH)₃ (clinoatacamite) and brown residues consisting of Cu₂O (cuprite). MFG test produced sulfides of copper (major) and nickel (minor).

Original language	English
Pages (from-to)	84-92
Number of pages	9
Journal	Microelectronics Reliability
Volume	60
DOIs	https://doi.org/10.1016/j.microrel.2016.02.014
Publication status	Published - May 1 2016
Externally published	Yes

Bibliographical note

Publisher Copyright:
© 2016 Elsevier Ltd.

ASJC Scopus Subject Areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Safety, Risk, Reliability and Quality
Condensed Matter Physics
Surfaces, Coatings and Films
Electrical and Electronic Engineering

Keywords

Atmospheric corrosion
Corrosion resistance
Electrodeposition
Nickel
Nickel-phosphorus
Pitting corrosion

Access to Document

10.1016/j.microrel.2016.02.014

Cite this

@article{d9674b065983454db29ba1b700d68c88,

title = "Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts",

abstract = "Atmospheric corrosion has vast consequences on the reliability of electronic connectors. This study determined the corrosion resistance of Ni/Ni-P plating metallurgy as a function of plating current density and plating thickness. Discrepancy was observed in the neutral salt spray (NSS) and mixed flowing gas (MFG) tests. Thicker Ni-P deposits displayed superior corrosion resistance in MFG tests while thinner Ni-P deposits performed better in NSS tests. This disparity was attributed to the intrinsic corrosion susceptibility of Ni-P against chlorine or sulfur assisted corrosion. Corrosion products were analysed for better understanding of the corrosion mechanism. NSS test produced green corrosion residues consisting of CuCl (nantokite) and CuCl2(OH)3 (clinoatacamite) and brown residues consisting of Cu2O (cuprite). MFG test produced sulfides of copper (major) and nickel (minor).",

keywords = "Atmospheric corrosion, Corrosion resistance, Electrodeposition, Nickel, Nickel-phosphorus, Pitting corrosion",

author = "Murugan, {Vinod K.} and Zhigang Jia and Syaranamual, {Govindo J.} and Gan, {Chee Lip} and Yizhong Huang and Zhong Chen",

note = "Publisher Copyright: {\textcopyright} 2016 Elsevier Ltd.",

year = "2016",

month = may,

day = "1",

doi = "10.1016/j.microrel.2016.02.014",

language = "English",

volume = "60",

pages = "84--92",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier Limited",

}

TY - JOUR

T1 - Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts

AU - Murugan, Vinod K.

AU - Jia, Zhigang

AU - Syaranamual, Govindo J.

AU - Gan, Chee Lip

AU - Huang, Yizhong

AU - Chen, Zhong

PY - 2016/5/1

Y1 - 2016/5/1

N2 - Atmospheric corrosion has vast consequences on the reliability of electronic connectors. This study determined the corrosion resistance of Ni/Ni-P plating metallurgy as a function of plating current density and plating thickness. Discrepancy was observed in the neutral salt spray (NSS) and mixed flowing gas (MFG) tests. Thicker Ni-P deposits displayed superior corrosion resistance in MFG tests while thinner Ni-P deposits performed better in NSS tests. This disparity was attributed to the intrinsic corrosion susceptibility of Ni-P against chlorine or sulfur assisted corrosion. Corrosion products were analysed for better understanding of the corrosion mechanism. NSS test produced green corrosion residues consisting of CuCl (nantokite) and CuCl2(OH)3 (clinoatacamite) and brown residues consisting of Cu2O (cuprite). MFG test produced sulfides of copper (major) and nickel (minor).

AB - Atmospheric corrosion has vast consequences on the reliability of electronic connectors. This study determined the corrosion resistance of Ni/Ni-P plating metallurgy as a function of plating current density and plating thickness. Discrepancy was observed in the neutral salt spray (NSS) and mixed flowing gas (MFG) tests. Thicker Ni-P deposits displayed superior corrosion resistance in MFG tests while thinner Ni-P deposits performed better in NSS tests. This disparity was attributed to the intrinsic corrosion susceptibility of Ni-P against chlorine or sulfur assisted corrosion. Corrosion products were analysed for better understanding of the corrosion mechanism. NSS test produced green corrosion residues consisting of CuCl (nantokite) and CuCl2(OH)3 (clinoatacamite) and brown residues consisting of Cu2O (cuprite). MFG test produced sulfides of copper (major) and nickel (minor).

KW - Atmospheric corrosion

KW - Corrosion resistance

KW - Electrodeposition

KW - Nickel

KW - Nickel-phosphorus

KW - Pitting corrosion

UR - http://www.scopus.com/inward/record.url?scp=84977747074&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84977747074&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2016.02.014

DO - 10.1016/j.microrel.2016.02.014

M3 - Article

AN - SCOPUS:84977747074

SN - 0026-2714

VL - 60

SP - 84

EP - 92

JO - Microelectronics Reliability

JF - Microelectronics Reliability

ER -

Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts

Abstract

Bibliographical note

ASJC Scopus Subject Areas

Keywords

Access to Document

Other files and links

Fingerprint

Cite this