Behavior of resorcinol based phthalonitrile as high temperature encapsulant

Yu Shan Tay; Jian Rong Eric Phua; Chee Lip Gan

doi:10.1109/EPTC47984.2019.9026569

Behavior of resorcinol based phthalonitrile as high temperature encapsulant

Yu Shan Tay, Jian Rong Eric Phua, Chee Lip Gan^*

^*Corresponding author for this work

Nanyang Technological University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

The increasing demand of harsh environment applications have propelled the engineering frontier for ruggedized electronics packaging. The need for alternative high temperature materials such as Phthalonitrile-based polymers has been on the rise to substitute the epoxy counterparts which have limited progression for such harsh environment applications. Resorcinol-based phthalonitrile (PN), known for their high thermal stability and good mechanical properties, can be a good candidate. However, investigations of PN as a microelectronics packaging material have not been substantial. Moreover, addition of fillers as well as the different filler types can alter the properties of PN such as its thermal behavior. This study looks into how alumina fillers affect the dielectric property, bulk resistivity and thermal conductivity of PN, which provides an insight of using PN as an encapsulation material for high temperature applications.

Original language	English
Title of host publication	2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	711-715
Number of pages	5
ISBN (Electronic)	9781728138350
DOIs	https://doi.org/10.1109/EPTC47984.2019.9026569
Publication status	Published - Dec 2019
Externally published	Yes
Event	21st IEEE Electronics Packaging Technology Conference, EPTC 2019 - Singapore, Singapore Duration: Dec 4 2019 → Dec 6 2019

Publication series

Name	2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019

Conference

Conference	21st IEEE Electronics Packaging Technology Conference, EPTC 2019
Country/Territory	Singapore
City	Singapore
Period	12/4/19 → 12/6/19

Bibliographical note

Publisher Copyright:
© 2019 IEEE.

ASJC Scopus Subject Areas

Fluid Flow and Transfer Processes
Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Electronic, Optical and Magnetic Materials
Metals and Alloys
Polymers and Plastics
Instrumentation

Access to Document

10.1109/EPTC47984.2019.9026569

Cite this

Tay, Y. S., Phua, J. R. E., & Gan, C. L. (2019). Behavior of resorcinol based phthalonitrile as high temperature encapsulant. In 2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019 (pp. 711-715). Article 9026569 (2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC47984.2019.9026569

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abstract = "The increasing demand of harsh environment applications have propelled the engineering frontier for ruggedized electronics packaging. The need for alternative high temperature materials such as Phthalonitrile-based polymers has been on the rise to substitute the epoxy counterparts which have limited progression for such harsh environment applications. Resorcinol-based phthalonitrile (PN), known for their high thermal stability and good mechanical properties, can be a good candidate. However, investigations of PN as a microelectronics packaging material have not been substantial. Moreover, addition of fillers as well as the different filler types can alter the properties of PN such as its thermal behavior. This study looks into how alumina fillers affect the dielectric property, bulk resistivity and thermal conductivity of PN, which provides an insight of using PN as an encapsulation material for high temperature applications.",

author = "Tay, {Yu Shan} and Phua, {Jian Rong Eric} and Gan, {Chee Lip}",

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Tay, YS, Phua, JRE & Gan, CL 2019, Behavior of resorcinol based phthalonitrile as high temperature encapsulant. in 2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019., 9026569, 2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019, Institute of Electrical and Electronics Engineers Inc., pp. 711-715, 21st IEEE Electronics Packaging Technology Conference, EPTC 2019, Singapore, Singapore, 12/4/19. https://doi.org/10.1109/EPTC47984.2019.9026569

Behavior of resorcinol based phthalonitrile as high temperature encapsulant. / Tay, Yu Shan; Phua, Jian Rong Eric; Gan, Chee Lip.
2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 711-715 9026569 (2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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N2 - The increasing demand of harsh environment applications have propelled the engineering frontier for ruggedized electronics packaging. The need for alternative high temperature materials such as Phthalonitrile-based polymers has been on the rise to substitute the epoxy counterparts which have limited progression for such harsh environment applications. Resorcinol-based phthalonitrile (PN), known for their high thermal stability and good mechanical properties, can be a good candidate. However, investigations of PN as a microelectronics packaging material have not been substantial. Moreover, addition of fillers as well as the different filler types can alter the properties of PN such as its thermal behavior. This study looks into how alumina fillers affect the dielectric property, bulk resistivity and thermal conductivity of PN, which provides an insight of using PN as an encapsulation material for high temperature applications.

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Behavior of resorcinol based phthalonitrile as high temperature encapsulant

Abstract

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