Bimodal dielectric breakdown failure mechanisms in Cu-SiOC low-k interconnect system

Keyphrases

• Breakdown Failure 100%
• Breakdown Mechanism 50%
• Burn Marks 50%
• Cu Particles 50%
• Dielectric Breakdown 100%
• Failure Distribution 50%
• Interconnected Systems 100%
• Intrinsic Breakdown 50%
• Low-k Dielectric 50%
• Particle Contamination 50%
• Physical Failure 50%
• Silicon Oxycarbide (SiOC) 100%
• Temperature Independence 50%
• Thermal Breakdown 50%

Material Science

• Current-Voltage Characteristic 50%