Binder system for micropowder injection molding

Z. Y. Liu; N. H. Loh; S. B. Tor; K. A. Khor; Y. Murakoshi; R. Maeda

doi:10.1016/S0167-577X(00)00276-7

Binder system for micropowder injection molding

Z. Y. Liu^*, N. H. Loh, S. B. Tor, K. A. Khor, Y. Murakoshi, R. Maeda

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

114 Citations (Scopus)

Abstract

To exploit the potential of microsystem technology, micropowder injection molding (μPIM), an economical mass production technology of microparts, is currently being investigated. Present work focused on establishing a suitable binder system for μPIM. Multicomponent binder systems, comprising of different weight percentages of Paraffin Wax (PW), Ethylene Vinyl Acetate (EVA) and High Density Polyethylene (HDPE) were investigated. The findings indicate that 316L stainless steel microparts in dimensions of 100×100×250 μm can be molded, debound and sintered successfully using a 20 wt.% PW+40 wt.% EVA+40 wt.% HDPE binder system.

Original language	English
Pages (from-to)	31-38
Number of pages	8
Journal	Materials Letters
Volume	48
Issue number	1
DOIs	https://doi.org/10.1016/S0167-577X(00)00276-7
Publication status	Published - Mar 2001
Externally published	Yes

ASJC Scopus Subject Areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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Cite this

@article{0b7cd3f7be834d40b99f8dfe29f3bfee,

title = "Binder system for micropowder injection molding",

abstract = "To exploit the potential of microsystem technology, micropowder injection molding (μPIM), an economical mass production technology of microparts, is currently being investigated. Present work focused on establishing a suitable binder system for μPIM. Multicomponent binder systems, comprising of different weight percentages of Paraffin Wax (PW), Ethylene Vinyl Acetate (EVA) and High Density Polyethylene (HDPE) were investigated. The findings indicate that 316L stainless steel microparts in dimensions of 100×100×250 μm can be molded, debound and sintered successfully using a 20 wt.\% PW+40 wt.\% EVA+40 wt.\% HDPE binder system.",

author = "Liu, \{Z. Y.\} and Loh, \{N. H.\} and Tor, \{S. B.\} and Khor, \{K. A.\} and Y. Murakoshi and R. Maeda",

year = "2001",

month = mar,

doi = "10.1016/S0167-577X(00)00276-7",

language = "English",

volume = "48",

pages = "31--38",

journal = "Materials Letters",

issn = "0167-577X",

publisher = "Elsevier",

number = "1",

}

TY - JOUR

T1 - Binder system for micropowder injection molding

AU - Liu, Z. Y.

AU - Loh, N. H.

AU - Tor, S. B.

AU - Khor, K. A.

AU - Murakoshi, Y.

AU - Maeda, R.

PY - 2001/3

Y1 - 2001/3

N2 - To exploit the potential of microsystem technology, micropowder injection molding (μPIM), an economical mass production technology of microparts, is currently being investigated. Present work focused on establishing a suitable binder system for μPIM. Multicomponent binder systems, comprising of different weight percentages of Paraffin Wax (PW), Ethylene Vinyl Acetate (EVA) and High Density Polyethylene (HDPE) were investigated. The findings indicate that 316L stainless steel microparts in dimensions of 100×100×250 μm can be molded, debound and sintered successfully using a 20 wt.% PW+40 wt.% EVA+40 wt.% HDPE binder system.

AB - To exploit the potential of microsystem technology, micropowder injection molding (μPIM), an economical mass production technology of microparts, is currently being investigated. Present work focused on establishing a suitable binder system for μPIM. Multicomponent binder systems, comprising of different weight percentages of Paraffin Wax (PW), Ethylene Vinyl Acetate (EVA) and High Density Polyethylene (HDPE) were investigated. The findings indicate that 316L stainless steel microparts in dimensions of 100×100×250 μm can be molded, debound and sintered successfully using a 20 wt.% PW+40 wt.% EVA+40 wt.% HDPE binder system.

UR - http://www.scopus.com/inward/record.url?scp=0034831527&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0034831527&partnerID=8YFLogxK

U2 - 10.1016/S0167-577X(00)00276-7

DO - 10.1016/S0167-577X(00)00276-7

M3 - Article

AN - SCOPUS:0034831527

SN - 0167-577X

VL - 48

SP - 31

EP - 38

JO - Materials Letters

JF - Materials Letters

IS - 1

ER -

Binder system for micropowder injection molding

Abstract

ASJC Scopus Subject Areas

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