@inproceedings{241c2a6aac804603822cb551f0c1c554,
title = "Carbon based multi-functional materials towards 3D system integration. Application to thermal and interconnect management",
abstract = "In order to meet the demands of increasing package density and miniaturization of devices without compromising performance, the most challenging issues to tackle are thermal and interconnect management. In this paper, we will first understand the interfacial transport between Si and Carbon for better system integration and discuss how novel carbon films can be used for thermal extraction. Second, we will show how carbon nanotubes can be used as interconnects using a flip chip approach as well as potential radio frequency applications.",
keywords = "Carbon based technologies, Carbon nanotubes, Interconnect technology, Thermal management",
author = "Chow, {W. L.} and Yap, {C. C.} and D. Tan and M. Shakerzadeh and Samani, {M. K.} and C. Brun and Teo, {E. H.T.} and D. Baillargeat and Tay, {B. K.}",
year = "2012",
doi = "10.1109/MWSYM.2012.6259415",
language = "English",
isbn = "9781467310871",
series = "IEEE MTT-S International Microwave Symposium Digest",
booktitle = "IMS 2012 - 2012 IEEE MTT-S International Microwave Symposium",
note = "2012 IEEE MTT-S International Microwave Symposium, IMS 2012 ; Conference date: 17-06-2012 Through 22-06-2012",
}