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Carbon based multi-functional materials towards 3D system integration. Application to thermal and interconnect management
W. L. Chow*, C. C. Yap, D. Tan, M. Shakerzadeh, M. K. Samani, C. Brun, E. H.T. Teo, D. Baillargeat, B. K. Tay
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1
Citation
(Scopus)