Carbon nanostructures dedicated to RF interconnect management

C. Brun; D. Baillargeat; Y. C. Chong; D. Tan; P. Coquet; B. K. Tay

doi:10.1109/EuMC.2014.6986719

Carbon nanostructures dedicated to RF interconnect management

C. Brun, D. Baillargeat, Y. C. Chong, D. Tan, P. Coquet, B. K. Tay

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Carbon nanotubes (CNTs) are a good candidate for RF interconnects, having better electrical as well as high frequency performance as compared to the conventional metals. To successfully integrate CNT to be in line with the industries trends, focus has to be placed on interfacial studies between electrode and CNT to obtain an effective conduction channel. In order to help component design, two modeling approaches are proposed: one is based on mesoscopic model for the electromagnetic properties of arrays of nanotubes, the other one on circuit simulation for RF applications. Several experimental works will be presented such as flip-chip report based on CNTs bumps and wireless link.

Original language	English
Title of host publication	European Microwave Week 2014
Subtitle of host publication	Connecting the Future, EuMW 2014 - Conference Proceedings; EuMC 2014: 44th European Microwave Conference
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1448-1451
Number of pages	4
ISBN (Electronic)	9782874870354
DOIs	https://doi.org/10.1109/EuMC.2014.6986719
Publication status	Published - Dec 15 2014
Externally published	Yes
Event	2014 44th European Microwave Conference, EuMC 2014 - Held as Part of the 17th European Microwave Week, EuMW 2014 - Rome, Italy Duration: Oct 6 2014 → Oct 9 2014

Publication series

Name	European Microwave Week 2014: Connecting the Future, EuMW 2014 - Conference Proceedings; EuMC 2014: 44th European Microwave Conference

Conference

Conference	2014 44th European Microwave Conference, EuMC 2014 - Held as Part of the 17th European Microwave Week, EuMW 2014
Country/Territory	Italy
City	Rome
Period	10/6/14 → 10/9/14

Bibliographical note

Publisher Copyright:
© 2014 European Microwave Association.

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Keywords

Carbon nanotubes
Electromagnetic modeling
Flip-chip
Monopole antennas

Access to Document

10.1109/EuMC.2014.6986719

Cite this

Brun, C., Baillargeat, D., Chong, Y. C., Tan, D., Coquet, P., & Tay, B. K. (2014). Carbon nanostructures dedicated to RF interconnect management. In European Microwave Week 2014: Connecting the Future, EuMW 2014 - Conference Proceedings; EuMC 2014: 44th European Microwave Conference (pp. 1448-1451). Article 6986719 (European Microwave Week 2014: Connecting the Future, EuMW 2014 - Conference Proceedings; EuMC 2014: 44th European Microwave Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EuMC.2014.6986719

Brun, C. ; Baillargeat, D. ; Chong, Y. C. et al. / Carbon nanostructures dedicated to RF interconnect management. European Microwave Week 2014: Connecting the Future, EuMW 2014 - Conference Proceedings; EuMC 2014: 44th European Microwave Conference. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 1448-1451 (European Microwave Week 2014: Connecting the Future, EuMW 2014 - Conference Proceedings; EuMC 2014: 44th European Microwave Conference).

@inproceedings{a75aee7bc6a040319582955102e57b9c,

title = "Carbon nanostructures dedicated to RF interconnect management",

abstract = "Carbon nanotubes (CNTs) are a good candidate for RF interconnects, having better electrical as well as high frequency performance as compared to the conventional metals. To successfully integrate CNT to be in line with the industries trends, focus has to be placed on interfacial studies between electrode and CNT to obtain an effective conduction channel. In order to help component design, two modeling approaches are proposed: one is based on mesoscopic model for the electromagnetic properties of arrays of nanotubes, the other one on circuit simulation for RF applications. Several experimental works will be presented such as flip-chip report based on CNTs bumps and wireless link.",

keywords = "Carbon nanotubes, Electromagnetic modeling, Flip-chip, Monopole antennas",

author = "C. Brun and D. Baillargeat and Chong, {Y. C.} and D. Tan and P. Coquet and Tay, {B. K.}",

note = "Publisher Copyright: {\textcopyright} 2014 European Microwave Association.; 2014 44th European Microwave Conference, EuMC 2014 - Held as Part of the 17th European Microwave Week, EuMW 2014 ; Conference date: 06-10-2014 Through 09-10-2014",

year = "2014",

month = dec,

day = "15",

doi = "10.1109/EuMC.2014.6986719",

language = "English",

series = "European Microwave Week 2014: Connecting the Future, EuMW 2014 - Conference Proceedings; EuMC 2014: 44th European Microwave Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "1448--1451",

booktitle = "European Microwave Week 2014",

address = "United States",

}

Brun, C, Baillargeat, D, Chong, YC, Tan, D, Coquet, P & Tay, BK 2014, Carbon nanostructures dedicated to RF interconnect management. in European Microwave Week 2014: Connecting the Future, EuMW 2014 - Conference Proceedings; EuMC 2014: 44th European Microwave Conference., 6986719, European Microwave Week 2014: Connecting the Future, EuMW 2014 - Conference Proceedings; EuMC 2014: 44th European Microwave Conference, Institute of Electrical and Electronics Engineers Inc., pp. 1448-1451, 2014 44th European Microwave Conference, EuMC 2014 - Held as Part of the 17th European Microwave Week, EuMW 2014, Rome, Italy, 10/6/14. https://doi.org/10.1109/EuMC.2014.6986719

Carbon nanostructures dedicated to RF interconnect management. / Brun, C.; Baillargeat, D.; Chong, Y. C. et al.
European Microwave Week 2014: Connecting the Future, EuMW 2014 - Conference Proceedings; EuMC 2014: 44th European Microwave Conference. Institute of Electrical and Electronics Engineers Inc., 2014. p. 1448-1451 6986719 (European Microwave Week 2014: Connecting the Future, EuMW 2014 - Conference Proceedings; EuMC 2014: 44th European Microwave Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Carbon nanostructures dedicated to RF interconnect management

AU - Brun, C.

AU - Baillargeat, D.

AU - Chong, Y. C.

AU - Tan, D.

AU - Coquet, P.

AU - Tay, B. K.

PY - 2014/12/15

Y1 - 2014/12/15

N2 - Carbon nanotubes (CNTs) are a good candidate for RF interconnects, having better electrical as well as high frequency performance as compared to the conventional metals. To successfully integrate CNT to be in line with the industries trends, focus has to be placed on interfacial studies between electrode and CNT to obtain an effective conduction channel. In order to help component design, two modeling approaches are proposed: one is based on mesoscopic model for the electromagnetic properties of arrays of nanotubes, the other one on circuit simulation for RF applications. Several experimental works will be presented such as flip-chip report based on CNTs bumps and wireless link.

AB - Carbon nanotubes (CNTs) are a good candidate for RF interconnects, having better electrical as well as high frequency performance as compared to the conventional metals. To successfully integrate CNT to be in line with the industries trends, focus has to be placed on interfacial studies between electrode and CNT to obtain an effective conduction channel. In order to help component design, two modeling approaches are proposed: one is based on mesoscopic model for the electromagnetic properties of arrays of nanotubes, the other one on circuit simulation for RF applications. Several experimental works will be presented such as flip-chip report based on CNTs bumps and wireless link.

KW - Carbon nanotubes

KW - Electromagnetic modeling

KW - Flip-chip

KW - Monopole antennas

UR - http://www.scopus.com/inward/record.url?scp=84929258282&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84929258282&partnerID=8YFLogxK

U2 - 10.1109/EuMC.2014.6986719

DO - 10.1109/EuMC.2014.6986719

M3 - Conference contribution

AN - SCOPUS:84929258282

T3 - European Microwave Week 2014: Connecting the Future, EuMW 2014 - Conference Proceedings; EuMC 2014: 44th European Microwave Conference

SP - 1448

EP - 1451

BT - European Microwave Week 2014

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2014 44th European Microwave Conference, EuMC 2014 - Held as Part of the 17th European Microwave Week, EuMW 2014

Y2 - 6 October 2014 through 9 October 2014

ER -

Brun C, Baillargeat D, Chong YC, Tan D, Coquet P, Tay BK. Carbon nanostructures dedicated to RF interconnect management. In European Microwave Week 2014: Connecting the Future, EuMW 2014 - Conference Proceedings; EuMC 2014: 44th European Microwave Conference. Institute of Electrical and Electronics Engineers Inc. 2014. p. 1448-1451. 6986719. (European Microwave Week 2014: Connecting the Future, EuMW 2014 - Conference Proceedings; EuMC 2014: 44th European Microwave Conference). doi: 10.1109/EuMC.2014.6986719

Carbon nanostructures dedicated to RF interconnect management

Abstract

Publication series

Conference

Bibliographical note

ASJC Scopus Subject Areas

Keywords

Access to Document

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