Carbon nanotube bumps for the flip chip packaging system

Chin Chong Yap; Christophe Brun; Dunlin Tan; Hong Li; Edwin Hang Tong Teo; Dominique Baillargeat; Beng Kang Tay

doi:10.1186/1556-276X-7-105

Carbon nanotube bumps for the flip chip packaging system

Chin Chong Yap, Christophe Brun, Dunlin Tan, Hong Li, Edwin Hang Tong Teo, Dominique Baillargeat, Beng Kang Tay

Research output: Contribution to journal › Article › peer-review

28 Citations (Scopus)

Abstract

Carbon nanotube [CNT] interconnection bump joining methodology has been successfully demonstrated using flip chip test structures with bump pitches smaller than 150 μm. In this study, plasma-enhanced chemical vapor deposition approach is used to grow the CNT bumps onto the Au metallization lines. The CNT bumps on the die substrate are then 'inserted' into the CNT bumps on the carrier substrate to form the electrical connections (interconnection bumps) between each other. The mechanical strength and the concept of reworkable capabilities of the CNT interconnection bumps are investigated. Preliminary electrical characteristics show a linear relationship between current and voltage, suggesting that ohmic contacts are attained.

Original language	English
Article number	105
Journal	Nanoscale Research Letters
Volume	7
DOIs	https://doi.org/10.1186/1556-276X-7-105
Publication status	Published - 2012
Externally published	Yes

ASJC Scopus Subject Areas

General Materials Science
Condensed Matter Physics

Keywords

CNT bumps
Flip chip
Interconnects
Packaging

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10.1186/1556-276X-7-105

Cite this

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abstract = "Carbon nanotube [CNT] interconnection bump joining methodology has been successfully demonstrated using flip chip test structures with bump pitches smaller than 150 μm. In this study, plasma-enhanced chemical vapor deposition approach is used to grow the CNT bumps onto the Au metallization lines. The CNT bumps on the die substrate are then 'inserted' into the CNT bumps on the carrier substrate to form the electrical connections (interconnection bumps) between each other. The mechanical strength and the concept of reworkable capabilities of the CNT interconnection bumps are investigated. Preliminary electrical characteristics show a linear relationship between current and voltage, suggesting that ohmic contacts are attained.",

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AU - Yap, Chin Chong

AU - Brun, Christophe

AU - Tan, Dunlin

AU - Li, Hong

AU - Teo, Edwin Hang Tong

AU - Baillargeat, Dominique

AU - Tay, Beng Kang

PY - 2012

Y1 - 2012

N2 - Carbon nanotube [CNT] interconnection bump joining methodology has been successfully demonstrated using flip chip test structures with bump pitches smaller than 150 μm. In this study, plasma-enhanced chemical vapor deposition approach is used to grow the CNT bumps onto the Au metallization lines. The CNT bumps on the die substrate are then 'inserted' into the CNT bumps on the carrier substrate to form the electrical connections (interconnection bumps) between each other. The mechanical strength and the concept of reworkable capabilities of the CNT interconnection bumps are investigated. Preliminary electrical characteristics show a linear relationship between current and voltage, suggesting that ohmic contacts are attained.

AB - Carbon nanotube [CNT] interconnection bump joining methodology has been successfully demonstrated using flip chip test structures with bump pitches smaller than 150 μm. In this study, plasma-enhanced chemical vapor deposition approach is used to grow the CNT bumps onto the Au metallization lines. The CNT bumps on the die substrate are then 'inserted' into the CNT bumps on the carrier substrate to form the electrical connections (interconnection bumps) between each other. The mechanical strength and the concept of reworkable capabilities of the CNT interconnection bumps are investigated. Preliminary electrical characteristics show a linear relationship between current and voltage, suggesting that ohmic contacts are attained.

KW - CNT bumps

KW - Flip chip

KW - Interconnects

KW - Packaging

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Carbon nanotube bumps for the flip chip packaging system

Abstract

ASJC Scopus Subject Areas

Keywords

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