Carbon nanotubes based nanopackaging dedicated to innovative high frequency interconnections

D. Baillargeat; D. Tan; B. K. Tay

doi:10.1109/INEC.2014.7460443

Carbon nanotubes based nanopackaging dedicated to innovative high frequency interconnections

D. Baillargeat, D. Tan, B. K. Tay

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Nanoelectronics applications will face limits imposed by physics laws, material properties, circuits and systems characteristics, assembly conditions and many other challenges for achieving Moore and more than Moore Predictions. In this context, packaging is a major problem and will play a crucial role for enabling future nanoelectronics. In this context, Carbon nanotubes (CNTs) are a good candidate for RF interconnects, having better electrical as well as high frequency performance as compared to the conventional metals. In this study, CNTs are considered for high frequency interconnects based on flip-chip bounding. In order to help component design, a modeling approach based on circuit simulation is proposed. Several experimental works will be presented such as flip-chip report based on CNTs bumps and future work.

Original language	English
Title of host publication	2014 IEEE International Nanoelectronics Conference, INEC 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781479950379
DOIs	https://doi.org/10.1109/INEC.2014.7460443
Publication status	Published - Apr 26 2016
Externally published	Yes
Event	IEEE International Nanoelectronics Conference, INEC 2014 - Sapporo, Japan Duration: Jul 28 2014 → Jul 31 2014

Publication series

Name	2014 IEEE International Nanoelectronics Conference, INEC 2014

Conference

Conference	IEEE International Nanoelectronics Conference, INEC 2014
Country/Territory	Japan
City	Sapporo
Period	7/28/14 → 7/31/14

Bibliographical note

Publisher Copyright:
© 2014 IEEE.

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Keywords

Carbon nanotubes
Flip-chip bonding
Hybrid modeling
nanopackaging
Nanotechnology
RF interconnects

Access to Document

10.1109/INEC.2014.7460443

Cite this

Baillargeat, D., Tan, D., & Tay, B. K. (2016). Carbon nanotubes based nanopackaging dedicated to innovative high frequency interconnections. In 2014 IEEE International Nanoelectronics Conference, INEC 2014 Article 7460443 (2014 IEEE International Nanoelectronics Conference, INEC 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/INEC.2014.7460443

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abstract = "Nanoelectronics applications will face limits imposed by physics laws, material properties, circuits and systems characteristics, assembly conditions and many other challenges for achieving Moore and more than Moore Predictions. In this context, packaging is a major problem and will play a crucial role for enabling future nanoelectronics. In this context, Carbon nanotubes (CNTs) are a good candidate for RF interconnects, having better electrical as well as high frequency performance as compared to the conventional metals. In this study, CNTs are considered for high frequency interconnects based on flip-chip bounding. In order to help component design, a modeling approach based on circuit simulation is proposed. Several experimental works will be presented such as flip-chip report based on CNTs bumps and future work.",

keywords = "Carbon nanotubes, Flip-chip bonding, Hybrid modeling, nanopackaging, Nanotechnology, RF interconnects",

author = "D. Baillargeat and D. Tan and Tay, {B. K.}",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; IEEE International Nanoelectronics Conference, INEC 2014 ; Conference date: 28-07-2014 Through 31-07-2014",

year = "2016",

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day = "26",

doi = "10.1109/INEC.2014.7460443",

language = "English",

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Baillargeat, D, Tan, D & Tay, BK 2016, Carbon nanotubes based nanopackaging dedicated to innovative high frequency interconnections. in 2014 IEEE International Nanoelectronics Conference, INEC 2014., 7460443, 2014 IEEE International Nanoelectronics Conference, INEC 2014, Institute of Electrical and Electronics Engineers Inc., IEEE International Nanoelectronics Conference, INEC 2014, Sapporo, Japan, 7/28/14. https://doi.org/10.1109/INEC.2014.7460443

Carbon nanotubes based nanopackaging dedicated to innovative high frequency interconnections. / Baillargeat, D.; Tan, D.; Tay, B. K.
2014 IEEE International Nanoelectronics Conference, INEC 2014. Institute of Electrical and Electronics Engineers Inc., 2016. 7460443 (2014 IEEE International Nanoelectronics Conference, INEC 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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T1 - Carbon nanotubes based nanopackaging dedicated to innovative high frequency interconnections

AU - Baillargeat, D.

AU - Tan, D.

AU - Tay, B. K.

PY - 2016/4/26

Y1 - 2016/4/26

N2 - Nanoelectronics applications will face limits imposed by physics laws, material properties, circuits and systems characteristics, assembly conditions and many other challenges for achieving Moore and more than Moore Predictions. In this context, packaging is a major problem and will play a crucial role for enabling future nanoelectronics. In this context, Carbon nanotubes (CNTs) are a good candidate for RF interconnects, having better electrical as well as high frequency performance as compared to the conventional metals. In this study, CNTs are considered for high frequency interconnects based on flip-chip bounding. In order to help component design, a modeling approach based on circuit simulation is proposed. Several experimental works will be presented such as flip-chip report based on CNTs bumps and future work.

AB - Nanoelectronics applications will face limits imposed by physics laws, material properties, circuits and systems characteristics, assembly conditions and many other challenges for achieving Moore and more than Moore Predictions. In this context, packaging is a major problem and will play a crucial role for enabling future nanoelectronics. In this context, Carbon nanotubes (CNTs) are a good candidate for RF interconnects, having better electrical as well as high frequency performance as compared to the conventional metals. In this study, CNTs are considered for high frequency interconnects based on flip-chip bounding. In order to help component design, a modeling approach based on circuit simulation is proposed. Several experimental works will be presented such as flip-chip report based on CNTs bumps and future work.

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KW - Flip-chip bonding

KW - Hybrid modeling

KW - nanopackaging

KW - Nanotechnology

KW - RF interconnects

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Carbon nanotubes based nanopackaging dedicated to innovative high frequency interconnections

Abstract

Publication series

Conference

Bibliographical note

ASJC Scopus Subject Areas

Keywords

Access to Document

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