Characterisation of defects generated during constant current InGaN-on-silicon LED operation

R. I. Made, Yu Gao, G. J. Syaranamual, W. A. Sasangka, L. Zhang, Xuan Sang Nguyen, Y. Y. Tay, J. S. Herrin, C. V. Thompson, C. L. Gan*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

9 Citations (Scopus)

Abstract

We studied the degradation of MOCVD-grown InGaN LEDs on Si substrates under constant current stressing. Characterisations using Deep Level Transient Spectroscopy and Electron Energy Loss Spectroscopy on active areas showed that the stressing had generated defects that have trap states at 0.26 eV below the conduction band edge (Ec – 0.26 eV) and that correlated with the active area's lower nitrogen content as compared to unstressed samples. The combination of Current-Voltage, Electroluminescence, Cathodoluminescence, and device simulations indicate that an increase in the density of these defects is correlated with an increase in the non-radiative carrier recombination that causes degradation in light emission. Preventing formation of these defects will be critical for improving InGaN-on-silicon LED reliability.

Original languageEnglish
Pages (from-to)561-565
Number of pages5
JournalMicroelectronics Reliability
Volume76-77
DOIs
Publication statusPublished - Sept 2017
Externally publishedYes

Bibliographical note

Publisher Copyright:
© 2017 Elsevier Ltd

ASJC Scopus Subject Areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Keywords

  • Cathodoluminescence
  • Defects
  • DLTS
  • Electroluminescence
  • GaN reliability
  • InGaN degradation
  • InGaN LED
  • InGaN LED degradation
  • InGaN LED-on-silicon
  • LED reliability
  • MOCVD
  • Nitrogen vacancies
  • Reliability

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