Characterization of CNT interconnection bumps implemented for 1st level flip chip packaging

Chin Chong Yap; Dunlin Tan; Christophe Brun; Edwin Hang Tong Teo; Jun Wei; Baillargeat Dominique; Beng Kang Tay

doi:10.1109/EPTC.2011.6184414

Characterization of CNT interconnection bumps implemented for 1st level flip chip packaging

Chin Chong Yap^*, Dunlin Tan, Christophe Brun, Edwin Hang Tong Teo, Jun Wei, Baillargeat Dominique, Beng Kang Tay

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

The fabrication procedures to contact the carbon nanotubes (CNT) to metal surface determine the contact resistance of the CNT bump. The large contact resistance is seen as a limiting factor to realize practical application using CNT bumps. An alternative bonding solution using CNT in physical contact with CNT using CNT interconnection bump is proposed. A study was conducted to determine the relationship between the bonding loads and bump resistances. It was concluded that the bump resistance decreases exponentially with the bonding load due to the change in inter-tube spacing. The lowest achieved CNT interconnection bump resistivity value was 0.05 Ω.cm.

Original language	English
Title of host publication	2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
Pages	195-198
Number of pages	4
DOIs	https://doi.org/10.1109/EPTC.2011.6184414
Publication status	Published - 2011
Externally published	Yes
Event	2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 - Singapore, Singapore Duration: Dec 7 2011 → Dec 9 2011

Publication series

Name	2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

Conference

Conference	2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
Country/Territory	Singapore
City	Singapore
Period	12/7/11 → 12/9/11

ASJC Scopus Subject Areas

Electrical and Electronic Engineering

Access to Document

10.1109/EPTC.2011.6184414

Cite this

Yap, C. C., Tan, D., Brun, C., Teo, E. H. T., Wei, J., Dominique, B., & Tay, B. K. (2011). Characterization of CNT interconnection bumps implemented for 1st level flip chip packaging. In 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 (pp. 195-198). Article 6184414 (2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011). https://doi.org/10.1109/EPTC.2011.6184414

@inproceedings{329d31f8419640a38b92ed89973a7cfd,

title = "Characterization of CNT interconnection bumps implemented for 1st level flip chip packaging",

abstract = "The fabrication procedures to contact the carbon nanotubes (CNT) to metal surface determine the contact resistance of the CNT bump. The large contact resistance is seen as a limiting factor to realize practical application using CNT bumps. An alternative bonding solution using CNT in physical contact with CNT using CNT interconnection bump is proposed. A study was conducted to determine the relationship between the bonding loads and bump resistances. It was concluded that the bump resistance decreases exponentially with the bonding load due to the change in inter-tube spacing. The lowest achieved CNT interconnection bump resistivity value was 0.05 Ω.cm.",

author = "Yap, {Chin Chong} and Dunlin Tan and Christophe Brun and Teo, {Edwin Hang Tong} and Jun Wei and Baillargeat Dominique and Tay, {Beng Kang}",

year = "2011",

doi = "10.1109/EPTC.2011.6184414",

language = "English",

isbn = "9781457719837",

series = "2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011",

pages = "195--198",

booktitle = "2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011",

note = "2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 ; Conference date: 07-12-2011 Through 09-12-2011",

}

Yap, CC, Tan, D, Brun, C, Teo, EHT, Wei, J, Dominique, B & Tay, BK 2011, Characterization of CNT interconnection bumps implemented for 1st level flip chip packaging. in 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011., 6184414, 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011, pp. 195-198, 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011, Singapore, Singapore, 12/7/11. https://doi.org/10.1109/EPTC.2011.6184414

Characterization of CNT interconnection bumps implemented for 1st level flip chip packaging. / Yap, Chin Chong; Tan, Dunlin; Brun, Christophe et al.
2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011. 2011. p. 195-198 6184414 (2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Characterization of CNT interconnection bumps implemented for 1st level flip chip packaging

AU - Yap, Chin Chong

AU - Tan, Dunlin

AU - Brun, Christophe

AU - Teo, Edwin Hang Tong

AU - Wei, Jun

AU - Dominique, Baillargeat

AU - Tay, Beng Kang

PY - 2011

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N2 - The fabrication procedures to contact the carbon nanotubes (CNT) to metal surface determine the contact resistance of the CNT bump. The large contact resistance is seen as a limiting factor to realize practical application using CNT bumps. An alternative bonding solution using CNT in physical contact with CNT using CNT interconnection bump is proposed. A study was conducted to determine the relationship between the bonding loads and bump resistances. It was concluded that the bump resistance decreases exponentially with the bonding load due to the change in inter-tube spacing. The lowest achieved CNT interconnection bump resistivity value was 0.05 Ω.cm.

AB - The fabrication procedures to contact the carbon nanotubes (CNT) to metal surface determine the contact resistance of the CNT bump. The large contact resistance is seen as a limiting factor to realize practical application using CNT bumps. An alternative bonding solution using CNT in physical contact with CNT using CNT interconnection bump is proposed. A study was conducted to determine the relationship between the bonding loads and bump resistances. It was concluded that the bump resistance decreases exponentially with the bonding load due to the change in inter-tube spacing. The lowest achieved CNT interconnection bump resistivity value was 0.05 Ω.cm.

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BT - 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

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Y2 - 7 December 2011 through 9 December 2011

ER -

Characterization of CNT interconnection bumps implemented for 1st level flip chip packaging

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