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Characterization of CNT interconnection bumps implemented for 1st level flip chip packaging
Chin Chong Yap*, Dunlin Tan, Christophe Brun, Edwin Hang Tong Teo, Jun Wei, Baillargeat Dominique, Beng Kang Tay
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1
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(Scopus)